硅片夹
A silicon diffusion pressure sensor is used to measure vacuum degree of chuck table to ensure that wafer is firmly chucked during grinding.
真空吸盘真空度的测量使用扩散硅压力传感器,实时测量出真空度的大小,保证硅片在加工过程中可靠夹紧。
A novel in-situ non-flatness measurement method wafer chuck in step-and-scan projection lithographic tool is presented.
提出一种新的步进扫描投影光刻机工件台方镜不平度测量方法.
A novel in-situ non-flatness measurement method of wafer chuck in step-and-scan projection lithographic tool is presented.
提出一种步进扫描投影 光刻机 承片台不平度检测新技术.
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